Fill‑Pad UT600 is an ultra‑thin gap filler material with thermal conductivity of 6.0W/m・K, featuring good surface wetting properties and high flexibility. Designed for thin‑gap interfaces, it is glass‑fiber‑free while retaining good mechanical properties for easy assembly handling. Adopting non‑silicone formula, it brings zero silicone contamination, low volatility and low oil bleeding. It features low residual stress and good self‑healing capability with high dielectric strength, especially suitable for electronic devices sensitive to silicone volatiles. The standard grade is naturally tacky on both sides; A1 single‑sided tackified or NT1 single‑sided detackified options are available for special applications. Working temperature:‑40℃ ~ 125℃, UL94 V‑0 flammability rating.

It is widely used for optical modules, telecommunications & wireless infrastructure, network servers, IGBT components, industrial & LED lighting and power modules, LCD/PDP/laser TV displays, HDD & SSD storage devices.

Light grey color; thickness range 0.2‑0.5mm, density 3.1g/cm³, hardness 70 Shore OO; outgassing TML 0.10%; thermal resistance 0.05℃・in²/W at 0.2mm@10psi; dielectric constant 8.1@1MHz; dielectric strength ≥7kV/mm; volume resistivity ≥1.0×10¹³Ω・cm.

Thickness tolerance: ≥1mm ±10%; ＜1mm ±0.1mm. Custom cut parts within 457×457mm are available. Optional A1 single‑sided tackified or NT1 single‑sided detackified versions. Storage: 0‑35℃, ≤65% RH; shelf‑life 12 months from the packing date. Do not ingest; keep away from children and combustion sources; keep bonding interface clean and refer to MSDS for full guidance.