Thermally Conductive Phase Change Material
Fill-PCM 550/550SP
☑ Extremely low thermal resistance
☑ Silicone free, no silicone contamination
☑ Natural tacky, stick on the surface of heat sink directly, no additional adhesive
☑ High reliability, no pump out/dry out/crack/slump in long term application
☑ Good handling and reworkability
☑ Soft at room temperature, less stress on board during assembly
Datasheet
FAQ
- What is Fill PCM 550 Series?
Fill‑PCM 550 series is silicone‑free thermal phase‑change material, thermal conductivity 5.5W/m・K, phase‑change temperature 45℃. Naturally tacky without extra adhesive; soft at room‑temp, good reworkability, no pump‑out/dry‑out/crack/slump. Two versions: Fill‑PCM 550 sheet type & printable Fill‑PCM 550SP. Working temperature:‑40℃ ~ 125℃, UL94 V‑0.
- What applications is Fill PCM 550 Series suitable for?
It applies to notebooks, desktops, graphic chips, memory devices, consumer electronics, automotive electronics, TV and game consoles.
- What are its main key parameters?
Grey color; sheet thickness 0.15‑0.50mm; phase‑change temperature 45℃; min bondline 25μm; density:2.75g/cm³(550), 2.4g/cm³(550SP with solvent); thermal resistance 0.017@10psi / 0.009℃・in²/W@40psi; volume resistivity ≥1.0×10¹²Ω・cm.
- What are ordering specifications and storage conditions?
Forms: sheet, roll, die‑cut parts; 550SP paste available in cartridge / aluminum tube / jar; custom size ≤400400mm. Store at 15‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS (SDS) for safety instructions.
