Thermally Conductive Phase Change Material
Fill-PCM P400
☑ Extremely low thermal resistance
☑ Silicone free, no silicone contamination
☑ High insulation
☑ High puncture resistance
☑ Good reworkability
☑ High reliability
Datasheet
FAQ
- What is Fill PCM P400?
Fill‑PCM P400 is silicone‑free thermal phase‑change composite with sandwich PI‑film substrate, PCM coated on both sides. Thermal conductivity 4.0W/m・K, phase‑change temperature 52℃. Delivers high insulation, puncture resistance and natural surface adhesion, targeted for IGBT & high‑power semiconductors. Working temperature:‑50℃ ~ 150℃, UL94 V‑0.
- What applications is Fill PCM P400 suitable for?
It applies to power semiconductors & modules especially IGBT, automotive electronics, graphic chips, memory devices and consumer electronics. Standard sizes fit TO‑220, TO‑247, TO‑3P, TO‑3PL, TO‑264 packages.
- What are its main key parameters?
White color; total thickness 0.15mm; phase‑change temperature 52℃; density 3.7g/cm³; thermal resistance 0.08@10psi / 0.065℃・in²/W@40psi; volume resistivity ≥1.0×10¹⁴Ω・cm; dielectric breakdown voltage ≥5kV.
- What are ordering specifications and storage conditions?
Forms: sheet, roll, die‑cut parts; custom size ≤400400mm, standard semiconductor package sizes available. Store at 15‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS (SDS) for safety instructions.
