Thermally Conductive Putty-Pad
Fill-PT 350GN
☑ High thermal conductivity of 3.5W/m-K
☑ Ultra-soft, low compression stress and residual stress
☑ High compressibility
☑ Excellent gap-filling capability
☑ Low oil-bleeding
☑ Excellent surface wetting
☑ Easy to handle
Datasheet
FAQ
- What is Fill PT 350GN?
Fill‑PT 350GN is glass‑fiber reinforced ultra‑soft thermal conductive putty pad, thermal conductivity 3.5W/m・K. Ultra‑low compression & residual stress, high compressibility, low oil‑bleeding, excellent gap‑filling; avoids pump‑out issue of thermal grease. Working temperature:‑50℃ ~ 200℃, UL94 V‑0.
- What applications is Fill PT 350GN suitable for?
It applies to 5G communication base stations, network servers, power devices & modules, optical modules, display equipment and hard‑disk storage devices.
- What are its main key parameters?
Green color; thickness 0.5‑5.0mm; density 3.1g/cm³; Shore OO hardness 10; TML outgassing 0.17%; thermal resistance 0.46℃・in²/W (1mm@10psi); volume resistivity ≥1.0×10¹³Ω・cm; dielectric constant 6.2@1MHz.
- What are ordering specifications and storage conditions?
Custom thickness & cut‑parts ≤457457mm; optional A1 (single‑sided tacky) / NT1 (single‑sided non‑tacky). Store at 0‑35℃, ≤65% RH, shelf‑life 12 months. Refer to MSDS (SDS) for safety instructions.
