Liquid Metal Model：Fill-LM SP5000

What is the Liquid Metal Fill-LM SP5000?

Fill-LM SP5000 is a high performance thermal conductive interface material of indium-tin alloy, which overcomes the disadvantages of weak ductility, inadequate surface wetting and complicated operation process of pure liquid metal. The product has good reliability and ductility, and engraved diamond or dot patterns on the surface ensures that it can fill the gap between the interfaces well and greatly reduce the contact thermal resistance. The physical and chemical properties of the product are stable, and it can still work normally in high temperature environment for a long time, which is much higher than other thermal conductive interface materials. Fill-LM SP5000 is designed for high power devices. It is simple to operate, and can be supplied as gap pad to meet different application environments.