Techinno Fill-Pad SF Series thermally conductive pad products are made of polyurethane resin and thermal conductive fillers. The unique formula achieves good mechanical propertiesand high resilience while also yielding optimized surface wetting and low thermal resistance.
The thickness ranges are from 0.5mm to 5.0mm. The thermal pads has the properties of low volatility and low oil bleeding, and contains no small silicone molecules. It is particularly suitable for electronic applications that are sensitive to silicone volatiles.
Pad Silicone Free Series
Typical Applications
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Telecommunications, Wireless Infrastructure, Optical Modules -
LCD, PDP, Laser TV displays -
Industry, LED lighting, Power Modules -
Hard Disk Drives and Solid Hard Disk Memory Devices -
Camera Modules -
Automotive Electronics
Specifications
Related Product
FAQ
Main Application Scenarios
5G communication base stations, wireless infrastructure and optical modules
It dissipates heat for core communication chips, protects precision optoelectronic devices and avoids signal interference and equipment contamination.
LCD, PDP and laser TV displays
It cools display drive chips and prevents screen black spots and abnormal light transmittance caused by silicone residue.
Industrial equipment, LED lighting and power modules
It fills gaps of power modules and LED structures to realize stable heat dissipation and prevent high-temperature aging.
Camera modules
It fits tiny gaps of precision optical modules and prevents lens fogging and blurry imaging caused by silicone pollution.
Hard disk drives and solid state drives (SSD)
It provides efficient heat conduction for storage chips to avoid operating lag and service life attenuation caused by overheating.
Heat dissipation between heating components and radiators or housings
It adapts to irregular assembly gaps of electronic components, eliminates air thermal resistance and conducts heat efficiently and evenly.
To ensure that Thermally Conductive Pads (Low Volatility Series) maintains stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:
Environmental conditions (applicable to all forms)
① Temperature: 0 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.
Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.
The packaging of Thermally Conductive Gaps (SF Series) shall comply with the following requirements:
Avoid contamination and compression, control temperature and humidity while keeping away from light, seal to prevent scratches, and limit stacking height.
Before use, inspect the thermally conductive pad for any signs of damage, scratches, bubbles, deformation, contamination, hardening, oil bleed, or cracking. If any are found, please discard it immediately and replace it with a new one.
- Thickness Tolerance: >1mm, +10%; 0.5-1mm, +0.1mm
- The thickness can be customized according to requirement.Please inquire the available thickness before ordering
- Custom sized configurations and/or cut parts are available with dimensions less than 457*457mm
- Versions A1 or NT1 can be supplied according to customer’s requirements. (A1: Single-sided tackified; NT1: Single-sided de-tackified)
For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.
① Do not eat
② Store away from children
③ Store away from combustion source
④ Please use in reference to MSDS
⑤ Keep the application interface clean
