As AI models scale up, computing power demand surges, driving 1.6T optical modules toward mass deployment and 3.2T+ products on the horizon. High-speed optical modules are vital for AI clusters, yet rising power densities and compact form factors intensify thermal challenges—especially with liquid cooling interfaces and repeated plugging cycles. Conventional […]

Background Booming AI and big data industries push chip power density higher, while conventional polymer-based thermal interface materials (TIMs) fail to cool high-power electronics effectively.   BiInSn liquid metal (melting point: 60 °C) stays solid at room temperature for easy processing, yet its thermal conductivity only hits 20 W·m⁻¹·K⁻¹ — merely 1/4

Fueled by AI, big data and 5G, automotive E/E architectures are evolving from distributed ECUs to centralized domain controllers and central computing platforms. ADAS domain SoCs process massive multi-sensor data and complex autonomous driving algorithms, leading to sharply elevated power density and heat generation, which creates tough thermal management bottlenecks.

As AI accelerators and high-performance compute nodes continue to scale, data centers are entering an era of unprecedented power density. Dense arrays of CPUs, GPUs, and optical transceivers leave minimal clearance between components, creating three critical thermal challenges:   Localized hot spotsfrom closely packed high-TDP chips, leading to frequency throttling

Driven by on-device large models, AR navigation and multi-screen interactive functions, modern intelligent cockpits require ever-increasing computing power. The soaring power consumption of main SoC chips brings severe heat dissipation challenges, becoming a core bottleneck restricting cockpit domain controller performance and reliability. Against this backdrop, high-performance thermal interface materials have