Techinno Fill-Pad Automation Series thermally conductive pad products are designed for high power and high heat applications requiring low compression force to conform over large dimensional variances or multiple gaps. While maintaining compliance with automated assembly requirements, the product achieves superior mechanical performance through optimized formulation.
Automation Series
Typical Applications
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Telecommunications, Wireless Infrastructure, Optical Modules -
LCD, PDP, Laser TV displays -
Industry, LED Lighting, Power Modules -
Hard Disk Drives and Solid Hard Disk Memory Devices -
Big Data Storage Device, Network Server
Specifications
Related Product
FAQ
Main Application Scenarios
1. 5G Communication base station, wireless communication equipment
Suitable for 5G base stations and various wireless communication equipment. It efficiently dissipates heat for high-power RF modules and main control boards, ensuring stable device operation and supporting automated mass production.
2. Big data storage device, network server
Ideal for 24/7 high-load big data storage devices and network servers. It solves overheating and performance degradation of core chips and supports automated batch assembly.
3. GPU Graphics Card Module
Perfect for high-performance GPU modules. It fills gaps between GPU cores, video memory and heat sinks, eliminates heat dissipation dead zones, and adapts to precise automated production.
4. Optical Transceiver Module
Designed for optical transceiver modules. With ultra-thin and high-fit performance, it ensures stable optical signal transmission and supports high-precision automated assembly.
5. LCD, PDP and Laser TV displays
Applicable to LCD, PDP and laser TVs. It provides uniform heat dissipation for display backlight modules and drive boards, delaying component aging and adapting to automated production.
6. Industrial, LED lighting
Suitable for industrial control equipment and high-power LED lighting. Featuring excellent temperature resistance, it prevents equipment failure and light decay, supporting automated batch production.
7. HDD (Hard Disk Drive) and SSD (Solid-State Drive) Storage Device
Ideal for HDD and SSD storage devices. The soft material protects storage components from extrusion, stabilizes read-write performance under high temperature and fits automated assembly processes.
To ensure that Thermally Conductive Pads (Automation Series) maintains stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:
Environmental conditions (applicable to all forms)
① Temperature: 0 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.
Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.
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The packaging of Thermally Conductive Pads (Automation Series) shall comply with the following requirements:
Avoid contamination and compression, control temperature and humidity while keeping away from light, seal to prevent scratches, and limit stacking height.
Before use, inspect the thermally conductive pad for any signs of damage, scratches, bubbles, deformation, contamination, hardening, oil bleed, or cracking. If any are found, please discard it immediately and replace it with a new one.
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- Thickness Tolerance: >1mm, ±10%; 0.5-1mm, ±0.1mm
- The thickness can be customized according to requirement.Please inquire the available thickness before ordering
- Customsized configurations and/or cut parts are available with dimensions less than 457*457mm
- Versions A1 or NT1 can be supplied according to customer’s requirements. (A1: Single-sided tackified; NT1: Single-sided de-tackified)
For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.
① Do not eat
② Store away from children
③ Store away from combustion source
④ Please use in reference to MSDS
⑤ Keep the application interface clean
