Fill-TPM Series is soft at room temperature and self-adhesive on the surface, providing excellent handling and reworking properties. This series has higher cohesion and self-healing ability, which can effectively prevent the large-size chips from warpage due to uneven heat generation, resulting in pump out. The products have excellent thermal conductivity and can meet the heat dissipation requirements of high power chips, and can be supplied in rolls, sheets or customized shapes and sizes to meet the needs of different customers.
Typical Applications
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Automotive Electronics -
CPU GPU Chips -
IGBT Modules -
Memory Devices -
TV, Game Console
Specifications
Related Product
FAQ
Thermally Conductive TPM is a kind of high‑performance thermal interface material. With its low thermal resistance and high reliability characteristics, it is widely used in electronic devices that require efficient heat dissipation. Major application scenarios include:
Thermally Conductive TPM for CPU,GPU, ASIC, LPU, and other chipset Applications
Used between the chip and the heat sink assembly. Upon temperature rise during device operation, the material softens to fully fill microscopic gaps, dramatically lowering interface thermal resistance and ensuring stable performance of thin-and-light laptops under high loads. Unlike conventional thermal grease, this ultra-thin interface material provides superior long-term reliability, resisting pump-out and dry-out, making it ideal for servers or work stations requiring sustained stable operation.
Thermally Conductive TPM for Gaming laptop Applications
Designed for high-heat-generation high-end gaming laptops, Thermally Conductive TPM efficiently conducts heat from the chip to the heatsink, mitigating hot spot risks. Its ability to adapt to uneven chip surfaces reduces localized temperature variations, ensuring stable memory/SSD performance under high-frequency read/write loads. This makes it especially ideal for professional graphics cards and high-end gaming GPUs.
Thermally Conductive TPM for Laser device Applications
For applications such as automotive LiDAR. When subjected to multiple stresses including temperature cycling and vibration, Thermally Conductive TPM delivers excellent long-term reliability for automotive-grade LiDAR, thanks to its superior self-healing properties and resistance to pump-out.
Thermally Conductive TPM for Automotive domain controller Applications
For heat dissipation of the main control chip in automotive-grade domain controllers. The product meets automotive requirements for temperature resistance, vibration resistance, and long service life, ensuring thermal management reliability in extreme environments (-40°C to 125°C).
To ensure that Thermally Conductive TPM maintains stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:
Environmental conditions
① Temperature: 15 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.
Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.
The packaging of Thermally Conductive TPM shall comply with the following requirements:
Please keep the original packaging sealed, and avoid folding, heavy pressing, or contact with sharp objects to prevent mechanical damage or contamination.
Pay attention to the integrity of the packaging. If the container has been opened and the material has become dry or brittle, it is recommended to discard it.
You can choose between sheet or roll form according to your application requirements. The ordering method is as follows:
Sheet form, roll form and die-cut parts are available.
Custom sized configurations and/or cut parts are available with dimensions less than 400*400mm.
For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.
① Do not eat
② Store away from children
③ Store away from combustion source
④ Please use in reference to MSDS
⑤ Keep the application interface clean
