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Communication & Data Center

Communication & Data Center

Faster connections between wireless devices and hyperscale cloud data services have built a heterogeneous remote data ecosystem, providing support for our daily lives. 5G low-latency broadband needs simultaneous links to countless Wi-Fi 6 access points, cellular towers and antennas, boosting demand for more access hardware and higher-performance data centers.

Thermal materials are vital to ensure reliable operation of electronic and optical systems across telecom and datacom infrastructure: from mobile terminals and in-datacenter data processing, to inter-data-center links and long-haul cross-border transmission.

Through optimized thermal management, system protection, robust electrical interconnection and outstanding long-term field stability, Techinno’s full range of TIM solutions enables reliable high-speed connectivity.

29/07/2026
With the rise of ChatGPT, generative AI requires upgraded specifications for cooling modules, driving them towards upgraded liquid cooling solutions.
29/07/2026
Driven by surging demand for AI computing power, the optical module market is experiencing explosive growth. With rapid iterations of 800G and 1.6T products, power consumption of single modules has risen to 25–45W, creating an increasingly severe conflict between high power draw and limited heat dissipation space.
29/07/2026
Driven by rapid AI iteration and surging computing power, data centers are stepping into high power density era. Network switches feature highly integrated onboard components including optical modules, power ICs and computing chips. Concentrated heat flux and limited PCB space bring severe thermal challenges, demanding high-performance board-level thermal management solutions.
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