Techinno Fill-Pad Low Dielectric Constant Series thermally conductive pad product is made of BN-filled silicone and features excellent thermal conductivity and low dielectric constant. Its excellent thermal conductivity and flexibility achieve lower thermal resistance.
It can be used to cover uneven or irregular device surfaces, fully fill the gap between heat-generating components and heat sinks, boards or chassis, and improve the working efficiency and life cycle of the device.
Low Dielectric Constant Series
Typical Applications
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Semiconductorequipment microwave components -
5G Base Station -
RF modules for mobile devices -
WiFi Module Chips
Specifications
Related Product
FAQ
Main Application Scenarios
1.Semiconductor equipment microwave components
Suitable for semiconductor precision equipment and microwave components such as antennas, filters and waveguides. The low dielectric characteristic suppresses high-frequency signal distortion and electromagnetic interference, while high thermal conductivity efficiently dissipates heat, preventing component thermal aging and ensuring stable device operation.
2. 5G Base Station
Applied to 5G macro/micro base stations, RRU, BBU and other core base station equipment. It fills assembly gaps for efficient heat dissipation, reduces high-frequency dielectric loss, stabilizes 5G signal transmission and improves equipment reliability.
3. RF modules for mobile devices
Used for RF transceivers, power amplifiers and antenna modules of smartphones, tablets and wearable devices. It optimizes RF signal transmission, avoids electromagnetic interference, and eliminates local overheating to stabilize terminal operation and prolong service life.
4. WiFi Module Chips
Ideal for WiFi 6/6E/7 module chips, routers, smart home terminals and wireless network cards. It provides efficient chip heat dissipation, prevents high-temperature performance degradation, and reduces signal loss and delay for stable high-speed wireless transmission.
To ensure that Thermally Conductive Pads (Low Dielectric Constant Series) maintains stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:
Environmental conditions (applicable to all forms)
① Temperature: 0 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.
Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.
The packaging of Thermally Conductive Pads (Low Dielectric Constant Series) shall comply with the following requirements:
Avoid contamination and compression, control temperature and humidity while keeping away from light, seal to prevent scratches, and limit stacking height.
Before use, inspect the thermally conductive pad for any signs of damage, scratches, bubbles, deformation, contamination, hardening, oil bleed, or cracking. If any are found, please discard it immediately and replace it with a new one.
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- Thickness tolerance of product: ≥1mm, ±10%; ＜1mm, ±0.1mm
- The thickness can be customized according to requirements. Please inquire the available thickness before ordering
- Customsized configurations and/or cut parts are available with dimensions less than 457*457mm
For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.
① Do not eat
② Store away from children
③ Store away from combustion source
④ Please use in reference to MSDS
⑤ Keep the application interface clean
