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Thermally Conductive Wave-absorbing Material

Absorb electromagnetic waves and reduce or eliminate electromagnetic interference

Techinno Fill-Hybrid Series products provide fast heat transfer while absorbing electromagnetic waves, thus reducing or eliminating electromagnetic interference and meeting the design requirements for miniaturised and ultra-thin equipment. These products have good thermal conductivity and good workability and can be quickly extruded for automatic dispensing operations with high efficiency and excellent reliability. They can be applied at low pressure to fill gaps at different heights or to protect sensitive electronic components in electronic assemblies that are used in small spaces and require low mechanical stress.

General Series

Typical Applications

  • ICs, Heat Sinks, Chassis or Related Thermal Modules
  • RF Applications
  • Smart Terminals, Mobile Phones, Tablets
  • Communication Devices

Specifications

FAQ

1.What are the main application scenarios for Thermally Conductive Wave-absorbing Material?

Thermally Conductive Wave-absorbing Material can absorb electromagnetic waves while enabling rapid heat transfer, thereby reducing or eliminating electromagnetic interference.Major application scenarios include:

Thermally Conductive Wave-absorbing Material for RF Applications

Thermally Conductive Wave-absorbing Material are products specifically developed to address the challenges of high frequency and high integration in today’s RF devices. By utilizing magnetic or dielectric loss components, they convert harmful electromagnetic wave energy into heat for absorption, effectively solving issues such as signal crosstalk and cavity resonance within RF systems, thereby ensuring clear and stable wireless communication signals.

Thermally Conductive Wave-absorbing Material for Communication Devices

Thermally Conductive Wave-absorbing Material can efficiently suppress EMI, effectively absorb internal crosstalk and external radiation, significantly improve signal transmission quality, ensure clarity and stability in high-speed data communication, effectively suppress resonances caused by higher-order harmonics to guarantee normal circuit operation, and absorb “creeping waves” propagating along the surface of conductors or transmission lines, thereby reducing unnecessary energy radiation and coupling.

2.How should Thermally Conductive Wave-absorbing Material be properly stored to ensure quality?

To ensure that Thermally Conductive Wave-absorbing Material maintain stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:

Environmental conditions
① Temperature: 0 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.

Shelf life
6 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.

3.How should Thermally Conductive Wave-absorbing Material be packaged?

The packaging of Thermally Conductive Wave-absorbing Material shall comply with the following requirements:

Please keep the original packaging sealed and store in a well-ventilated, cool, and dry place, away from open flames.

4.What are the precautions to be taken before using Thermally Conductive Wave-absorbing Material?

Pay attention to the integrity of the packaging. If there is obvious stratification, drying, hard lumps, or abnormal flow behavior, it is recommended to discard the product.

5.How to order Thermally Conductive Wave-absorbing Material?

The products can be provided in cartridge of 30cc, 300cc, and 5 gallon pail.

For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.

6.What key precautions and safety tips should be understood before use Thermally Conductive Wave-absorbing Material?

① Do not eat

② Store away from children

③ Store away from combustion source

④ Please use in reference to MSDS

⑤ Keep the application interface clean

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