Curable Thermally Conductive Gel: Fill-CIP 1120

What is the Curable Thermally Conductive Gel Fill-CIP 1120？

Fill-CIP 1120 is a high-performance, single-part, curable liquid gap filler with the thermal conductivity of 12.0W/m-K, which can offer low outgassing, low oil bleeding, long-term reliability and high flow rate. The product achieves a minimal BLT of lower than 0.19 mm, and its excellent wettability minimizes thermal resistance at interfaces, while maintaining excellent performance in vertical or vibration applications.

Based on its high thixotropy and flexibility, Fill-CIP 1120 is ideal for applications with uneven gap between multiple components and a common heat sink, and suitable for high-power heat generating components such as optical modules. Furthermore, it is also used in electronic components requiring low mechanical stress to protect sensitive electronic components from damage.