Curable Thermally Conductive Gel: Fill-CIP 245LV

What is the Curable Thermally Conductive Gel Fill-CIP 245LV？

Fill-CIP 245LV is a low volatile two-component liquid gap filler with the thermal conductivity of 4.5W/m-K, which can offer long-term reliability and high dispense rate. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed. The mixed material in 1:1 ratio will cure at room temperature and can be accelerated with the addition of heat. Its high compressibility and excellent wetting property can minimize thermal resistance at interfaces, while maintaining excellent performance in vertical or vibration applications.

Fill-CIP 245LV is ideal for applications where uneven gap tolerances are present and filling variable gaps between multiple components and a common heat sink. And it is especially suitable for scenarios where outgassing is strictly prohibited such as optical devices.