Thermally Conductive Pad: Fill-Pad 800A

What is the Thermally Conductive Pad Fill-Pad 800A？

Techinno Fill-Pad 800A is a high performance gap filler material which combines 8.0W/m-K thermal conductivity with high compressibility under low pressure. It is designed for high power and high heat applications requiring low compression force to conform over large dimensional variances or multiple gaps. While maintaining compliance with automated assembly requirements, the product achieves superior mechanical performance through optimized formulation. The unique formula enables low compression stress while also remaining minimal residual stress on components. Its good surface wetting capability minimizes the interface thermal impedance. Fill-Pad 800A is especially suitable for applications which is sensitive to siloxane volatiles. It has very low outgassing and low oil bleeding performance. The standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.