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Thermally Conductive Pad: Fill-Pad 1200A

12.0W/mK Thermally Conductive Pad: Fill-Pad 1200A

  • Thermal Conductivity: 12.0W/m-K
  • Compatibility with automated assembly
  • High compressibility under low pressure
  • Low oil bleeding
  • Low outgassing, D3 -D10<10ppm
  • Good surface wetting

What is the Thermally Conductive Pad Fill-Pad 1200A?

Techinno Fill-Pad 1200A is a high performance gap filler material which combines 12.0W/m-K thermal conductivity with high compress-ibility under low pressure. It is designed for high power and high heat applications requiring low compression force to conform over large dimensional variances or multiple gaps. While maintaining compliance with automated assembly requirements, the product achieves superior mechanical performance through optimized formulation. The unique formula enables low compression stress while also remaining minimal residual stress on components. Its good surface wetting capability minimizes the interface thermal impedance. Fill-Pad 1200A is especially suitable for applications which is sensitive to siloxane volatiles. It has very low outgassing and low oil bleeding performance. The standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.

What are the main application scenarios for Fill-Pad 1200A?

The typical applications of Thermally Conductive Pad: Fill-Pad 1200A

5G Communication base station, wireless communication equipment
Big data storage device, network server
GPU Graphics Card Module
Optical Transceiver Module
LCD, PDP and Laser TV displays
Industrial, LED lighting
HDD (Hard Disk Drive) and SSD (Solid-State Drive) Storage Device

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