Thermally Conductive Pad: Fill-Pad LDK600
6.0W/mK Thermally Conductive Pad: Fill-Pad LDK600
- Thermal Conductivity: 6.0W/m-K
- Low dielectric constant
- High insulation
- Absorb vibration and reduce stress
- Lower hardness, excellent conformability
- Datasheet
What is the Thermally Conductive Pad Fill-Pad LDK600？
Fill-Pad LDK600 is a a high performance gap filler material which combines 6.0W/m-K thermal conductivity with good surface wetting and excellent mechanical properties. It can be used to cover uneven or irregular device surfaces, fully fill the gap between heat-generating components and heat sinks, boards or chassis, and improve the working efficiency and life cycle of the device.
Fill-Pad LDK600 is made of BN-filled silicone and features excellent thermal conductivity and low dielectric constant. Its excellent thermal conductivity and flexibility achieve lower thermal resistance. Fill-Pad LDK 600 absorbs vibration and reduces stress, effectively protecting electronic devices from damage.
What are the main application scenarios for Fill-Pad LDK600?
The typical applications of Thermally Conductive Pad: Fill-Pad LDK600
Semiconductorequipment microwave components
5G Base Station
RF modules for mobile devices
WiFi Module Chips
