Thermal Interface Solution for AI Servers
Background
GPU power consumption of AI servers keeps rising. Air cooling easily leads to thermal throttling and excessive energy consumption. Liquid cooling with cold plate is widely applied in general computing clusters, while immersion liquid cooling is applied for ultra-high computing power scenarios. Challenges including high heat flux and large interfacial thermal resistance drive the upgrade of high-performance thermal interface materials.
Recommended Materials for Cold Plate Liquid Cooling
- Thermally Conductive Phase Change Material Fill-PCM 800
- Thermally Conductive TPM Fill-TPM 800
Fill-PCM 800 Key Features
☑ Low thermal resistance
☑ Silicone-free, no silicone contamination
☑ Natural surface tack
☑ High long-term reliability
☑ Good handling and reworkability
Typical Applications
CPU, GPU, and other chipset
IGBT Module
Memory Modules
Automotive
TV, game console and other consumer electronics
Core Advantages
1.Ultra-Low Thermal Resistance
After phase change, Fill-PCM 800 achieves an ultra-thin BLT under low pressure. A thinner BLT greatly reduces interfacial thermal resistance, delivering outstanding low thermal resistance performance even with minimal pressure.
2.Outstanding Durability & Stability
Thermal performance remains intact after continuous high-temperature exposure, thermal shock and 85°C/85%RH humidity aging tests with no performance degradation.
3.User-Friendly Handling
Solid at room temperature before phase change with natural tack, enabling simple assembly and convenient rework.
Fill-TPM 800 Key Features
☑ Ultra-low thermal resistance
☑ Silicone-free
☑ High reliability
☑ Superior self-healing capability
☑ Soft texture, easy to install & reworkable
Typical Applications
CPU,GPU, ASIC, LPU, and other chipset
Automotive domain controller
Gaming laptop
Laser device
Core Advantages
1.Long-term Reliability
Fill-TPM 800 applied silicone-free base material. Its proprietary formula delivers strong cohesion and self-repair performance, effectively resolving common reliability risks such as dry-out and pump-out after long-term aging.
2.Ultra-Low Thermal Resistance
The material softens as temperature rises. It achieves thin BLT under low pressure, fully fills tiny interfacial gaps and drastically cuts contact thermal resistance.
3.Easy Handling & Rework
Soft and naturally tacky at room temperature, it enables simple assembly and convenient rework. It can be directly positioned and adhered onto chips or heat sinks.
Recommended Immersion Liquid Cooling Products
Liquid Metal Sheet Fill-LM SP5000
Liquid Metal Sheet Fill-LM SP8000
Fill-LM SP5000 Key Features
☑ Extremely high thermal conductivity
☑ Ultra-low thermal resistance
☑ High reliability
☑ Safe and environmentally friendly, not volatile
☑ High temperature tolerance
☑ Compatible with all coolants in immersion environments
Typical Applications
CPU, GPU and other chip-set
LED, laser and other optical devices
Servers, liquid cooling data center
Aerospace, military radar TR components
Test sorting
Core Advantages
1.Superior Thermal Conductivity
Made of special indium-tin alloy. Over 40% compression fills micro voids to reduce contact thermal resistance, ideal for high heat flux power devices.
2.Stable Performance Under Harsh Conditions
Stable physical and chemical properties with far better heat resistance than regular thermal materials; consistent performance during long-term operation.
3.Easy Assembly
Solid sheet with excellent ductility and wettability, The product can be directly used as a pad， with easy operation.
Fill-LM SP8000 Key Features
☑ Extremely high thermal conductivity
☑ Ultra-low thermal resistance
☑ High reliability
☑ Safe and environmentally friendly, not volatile
☑ High temperature tolerance
☑ Compatible with all coolants in immersion environments
Typical Applications
CPU, GPU and other chip-set
LED, laser and other optical devices
Servers, liquid cooling data center
Aerospace, military radar TR components
Test sorting
Core Advantages
1.Outstanding Thermal Performance
Custom indium-tin alloy with over 40% compression rate fills micro voids to reduce contact thermal resistance, perfectly suited for high-power and high heat flux devices.
2.Long-Term Stable & Reliable
Stable physical and chemical properties with excellent heat resistance, outperforming regular thermal materials under prolonged high-temperature working conditions.
3.Simple & Convenient Application
Solid sheet featuring superior ductility and wettability; can be directly used as thermal pads for easy handling.
