Thermal Solution for Network Switches

 

Background

Driven by rapid AI iteration and surging computing power, data centers are stepping into high power density era. Network switches feature highly integrated onboard components including optical modules, power ICs and computing chips. Concentrated heat flux and limited PCB space bring severe thermal challenges, demanding high-performance board-level thermal management solutions.

 

Recommended Materials

Thermally Conductive Pads Ultra Soft Series Fill-Pad US1200/1400/1600

 

Key Features

☑ Thermal Conductivity: 12-16W/m-K

☑ Good surface wetting property

☑ Good insulation

☑ Low volatility&Low oil bleeding

☑ No glass fibre reinforcement required

 

Typical Applications

Telecommunications, wireless infrastructure & optical modules

LCD, PDP, and Laser TV Monitor

Industry, LED lighting and power modules

Automotive electronics

Hard disk drives and solid hard disk memory devices

 

Core Advantages

1.Ultra High Thermal Conductivity

High thermal conductivity quickly dissipates chip heat to heat sinks, suitable for applications with strict thermal requirements.

2.Ultra-Soft & Low Stress

Super soft substrate with great wettability fits all interfaces. Proper residual stress ensures tight contact and reliable long-term service.

3.Long-Term High Reliability

Low volatility and minimal oil bleeding. Stable performance under variable pressure and temperature for long-term multi-scenario use.