Radar Thermal Conductivity Solutions
Background
Due to the miniaturized millimeter-wave radar and blind-spot radar in ADAD generating a large amount of chip heat, it affects the detection accuracy. Regular silicone produces volatiles which are easy to contaminate RF circuits. Vehicle vibration & temperature swings damage chips. Thermal materials with low outgassing and high automotive reliability is needed.
Thermal Solution for Blind Spot Radar
Recommended Materials
Curable Thermal Conductive Gel Fill-CIP245LV
Key Features
☑ Thermal conductivity: 4.5W/m-K
☑ Low volatile
☑ Easy for auto-dispensing
☑ Good wettability
☑ Low residue stress for sensitive components
☑ Good long-term reliability
Typical Applications
Automotive electronics and battery
Industry, LED lighting and power modules
Large storage data center
Smart phone and consumer electronics
Telecommunications equipments
Power electronics
Core Advantages
1.Low Volatility
It is a low-volatility, two-part, silicone thermal gap filler with thermal conductivity of 4.5 W/m-K. It has low viscosity and excellent thixotropy, and it can be automatically dispensed smoothly.
2.High Conformability & Efficient Thermal Conduction
Achieves over 70% compression under slight pressure, fully filling component gaps and forming thermal conductive bridges between devices and heat sinks.
3.Low-Stress Cushioning Protection
Forms a 3D elastomer after curing with ultra-low compressive and residual stress, preventing damage to sensitive components during assembly.
Thermal Solution for Millimeter-Wave Radar
Recommended Materials
Thermally Conductive Wave-absorbing Material Fill-Hybrid 400G
Key Features
High thermal conductivity
Excellent wave absorption, high magnetic loss
Reduce reflection in transmission
High reliability
Typical Applications
ICs, heat sinks, chassis or related thermal modules
RF Applications
Smart terminals, mobile phone, tablet computer
Communication devices
Core Advantages
1.Excellent Wave Absorption Performance
It absorbs electromagnetic waves while transferring heat rapidly to suppress EMI, and fits the miniaturized & ultra-thin design of electronic devices.
2.Easy Dispensing
Single-component gel with good extrudability supports high-speed automatic dispensing for great operational convenience and production efficiency.
3.Superior Reliability
Low outgassing formula meets automotive-grade standards. It fills uneven gaps under light pressure with low stress to fully protect sensitive electronic components during assembly.
