Thermal Solution for VR

 

Background

All-in-one VR/AR headsets combine optical and interactive sensing components. Higher integration generates more heat, leading to overheating and lag that affects wearing comfort and immersive experience. Their slim compact design calls for thermal materials that are low-stress, low-outgassing and fit tight gaps.

 

Recommended Materials

1.Thermally Conductive Gel Fill-Gel 600/ Fill-Gel 800/ Fill-Gel1000

2.Thermally Conductive Pad Fill-Pad US800

 

Fill-Gel 600/ Fill-Gel 800/ Fill-Gel1000 Key Features

☑ Thermal Conductivity: 6.0-10.0W/m-K

☑ High reliability and thermal stability

☑ No post cure, easily for auto-dispensing

☑ Low siloxane content

☑ High compressibility for low stress applications

☑ Low contact resistance

☑ No pump-out, no crack/sag at thermal cycling and vibration environment

 

Typical Applications

Chassis or the associated cooling module

Heating device requiring low assembly pressure

Smart terminals, mobile phone, tablet computer

Telecommunication base station

Large storage data center

Memory & Power Modules

 

Core Advantages

1.Superior Thermal Performance

Single-component non-curing thermal gel features high thixotropy and plasticity to fill wide, uneven gaps under light pressure. With thermal conductivity of 6.0–10.0 W/m-K, it efficiently dissipates heat for high-power devices.

2.Low-Stress Component Protection

Ultra-low compression stress fits precision parts and avoids damage to sensitive electronics during assembly.

3.Long-Term Stable Reliability

Low-outgassing formula resists sagging and cracking, maintaining stable shape under temperature cycling and vibration, ideal for communications equipment.

 

Fill-Pad US800 Key Features

☑ Thermal Conductivity: 8.0W/m-K

☑ Good surface wetting property

☑ Low compression force

☑ High compressibility

☑ Low oil bleeding

☑ Low outgassing

 

Typical Applications

Telecommunications, wireless infrastructure & network servers

Optical modules

Automotive electronics

Hard disk drives and solid hard disk memory devices

Industry, LED lighting and power modules

 

Core Advantages

1.Excellent Thermal Performance

Fill-Pad US800 delivers great thermal conductivity and stable low thermal resistance even under low pressure.

2.Ultra-Soft & Low-Stress

Ultra-soft, it is easily compressed under light pressure to fill gaps and stays tightly bonded for lasting reliable cooling.

3.Long-Term High Reliability

Low-outgassing and low-oozing formula resists pressure and temperature fluctuations, maintaining stable performance under diverse working conditions.