Thermal Solutions for Smart Car Domain Controllers
Background
Advanced autonomous driving pushes domain controllers to higher power, causing severe heat accumulation inside sealed housings that exceeds the traditional cooling capacity. High-performance thermal materials and solutions are required to stabilize chip temperatures and guarantee reliable operation of smart cockpit and driving systems in all road conditions.
Recommended Materials
- Phase Change Materials Fill-PCM 800
- Ultra Thin TIM Fill-TPM 800
Key Features
☑ Low thermal resistance
☑ Silicone-free, no silicone contamination
☑ Natural surface tack
☑ Low viscosity
☑ High long-term reliability
☑ Good handling and reworkability
Typical Applications
CPU, GPU, and other chipset
IGBT Module
Memory Modules
Automotive
TV, game console and other consumer electronics
Core Advantages
1.Ultra-Low Thermal Resistance
After phase change, Fill-PCM 800 achieves an ultra-thin BLT under low pressure. A thinner BLT greatly reduces interfacial thermal resistance, delivering outstanding low thermal resistance performance even with minimal pressure.
2.Long-Term Thermal Stability
Fill-PCM 800 retains its original thermal performance without degradation under sustained high temperatures, thermal shock and 85°C/85%RH humidity aging tests. It features excellent vibration and shock resistance to withstand harsh automotive operating conditions.
3.Easy Handling & Reworkable
The material remains solid at room temperature before phase change with inherent surface tackiness, offering excellent workability and rework capability.
Key Features
☑ Ultra-low thermal resistance
☑ Silicone-free
☑ High reliability
☑ Superior self-healing capability
☑ Soft texture, easy to install & reworkable
Typical Applications
CPU,GPU, ASIC, LPU, and other chipset
Automotive domain controller
Gaming laptop
Laser device
Core Advantages
1.Superior Anti-Sagging Performance
Fill-TPM800 maintains stable shape without sagging during testing. It retains great stability even under rigorous high-temperature endurance tests and delivers reliable long-term service. Its outstanding anti-sagging property meets strict stability requirements for automotive electronics and related industries.
2.Excellent Anti-Pump-Out Performance
Fill-TPM 800 has high cohesion. It achieves steady and reliable anti-pump-out performance under vibration cycles within 70–120 μm gap, keeping thermal resistance nearly constant. Consistent thermal resistance control is important for harsh applications such as autonomous driving domain controllers.
3.Vibration resistant, shockproof
Verified by dedicated mechanical tests, Fill-TPM 800 shows no obvious shifting or cracking during vibration cycling. It maintains structural stability across wide temperature ranges under sustained vibration. No displacement or cracking occurs during mechanical shock tests either, enabling the material to withstand heavy mechanical impacts with high reliability.
Recommended Materials
Fill-CIP 2100
Key Features
Thermal conductivity: 10.0W/m-K
Good surface wetting
Good thixotropic
High compressibility for low stress applications
Excellent slump resistance and high shear thinning characteristics
Good long-term reliability
Typical Applications
Automotive electronics and battery
Industry, LED lighting and power modules
Large storage data center
Smart phone and consumer electronics
Telecommunications equipments
Power electronics
Core Advantages
1.High-Efficiency Thermal Conduction
Featuring a thermal conductivity of 10.0 W/m-K, Fill-CIP 2100 efficiently dissipates heat from high-power chips for demanding thermal requirements. It balances high thermal performance and excellent extrusion, fitting high-speed automated production lines to improve assembly efficiency and production stability.
2.Low BLT & Low Stress
With superior precure thixotropy, the material achieves ultra-thin BLT below 0.2 mm under low pressure. It fully fills interface gaps while preventing stress concentration and chip cracking under compression. The low-pressure, low-thermal-resistance characteristic further optimizes heat dissipation and extends product lifespan.
3.Exceptional Environmental Reliability
Fill-CIP 2100 maintains stable thermal performance with no degradation after 1000 h @150°C high-temperature aging, -40°C~150°C thermal cycling, and 85°C/85%RH humidity aging. It delivers excellent anti-aging performance and strong adaptability to harsh automotive operating conditions.
