Thermal Conductivity Solutions for Optical Modules
Background
Driven by surging demand for AI computing power, the optical module market is experiencing explosive growth. With rapid iterations of 800G and 1.6T products, power consumption of single modules has risen to 25–45W, creating an increasingly severe conflict between high power draw and limited heat dissipation space.
Recommended Products
External module thermal interface material: Pluggable Material T-Plug 820S
Internal module thermal interface material: Curable Thermal Conductive Gel Fill-CIP1120
Product Features of T-Plug 820S
✔ Excellent plug-and-wear resistance
✔ Low interfacial thermal resistance
✔ Superior electrical insulation performance
✔ Long-term high reliability
Typical Applications
- Heat dissipation for removable 5G telecom modules
- Thermal management of pluggable optical modules
Core Advantages
1.Low Interfacial Thermal Resistance
Interfacial thermal resistance dominates optical module cooling efficiency. T-Plug 820S drastically reduces thermal resistance between optical cages and module housings, speeding heat transfer to cold plates and stabilizing high-power optical modules.
2.Superior Anti-Wear & Plug Cycle Durability
The T-Plug 820S has been optimized for the TIM damage caused by frequent module replacement, offering excellent wear resistance. Lab tests confirm endurance of over 2,000 plug-unplug cycles.
3.High Environmental Reliability
Data centers impose harsh operating conditions for thermal materials. Rigorous multi-condition testing proves T-Plug 820S delivers exceptional long-term reliability.
Product Features of Fill-CIP1120
✔ Thermal conductivity up to 12.0 W/m·K
✔ Single-component post-curing formula, compatible with automated mass production
Outstanding reliability and thermal stability
✔ Exceptional wettability
✔ Zero pump-out risk
Typical Applications
- Optical modules
- Heat dissipation for communication base station hardware
- EV power battery modules
- Automotive electronic components
- LED lighting systems
- Automotive domain controllers
Core Advantages
1.Outstanding Thermal Conductivity
With a thermal conductivity as high as 12.0 W/m-K, it exhibits excellent wettability before curing, capable of fully filling interfacial gaps and compensating for component tolerances, thereby reducing interfacial thermal resistance. It achieves low BLT under low pressure, maintaining normal operating temperatures for critical components.
2.Low Oil Bleed & Low Volatility
Fill-CIP 1120 delivers minimal volatility and oil bleed. Tested total outgassing ΣD3-D10 < 50 ppm to preserve precision of optical devices.
3.High Reliability
No thermal resistance rise was observed during high-temperature aging, thermal shock and 85°C/85%RH humidity testing. Its thermal performance remained consistent without degradation throughout all reliability tests.
