Thermal Solution for Drones
Background
High-power lightweight drones produce heavy heat from power and control chips. They face high-altitude temperature swings and constant vibration. Mass production demands simple, cost-effective assembly. The market needs low-density, low-resistance, low-outgassing, vibration-resistant thermal materials compatible with automated UAV manufacturing.
Recommended Materials
1.Thermally Conductive Gel Fill-Gel 600/ Fill-Gel 800/ Fill-Gel1000
2.Thermally Conductive Pad Fill-Pad US800
3.Thermally Conductive Pad Fill-Pad SF800
Fill-Gel 600/ Fill-Gel 800/ Fill-Gel1000 Key Features
☑ Thermal Conductivity: 6.0-10.0W/m-K
☑ High reliability and thermal stability
☑ No post cure, easily for auto-dispensing
☑ Low siloxane content
☑ High compressibility for low stress applications
☑ Low contact resistance
☑ No pump-out, no crack/slide at thermal cycling and vibration environment
Typical Applications
Chassis or the associated cooling module
Heating device requiring low assembly pressure
Smart terminals, mobile phone, tablet computer
Telecommunication base station
Large storage data center
Memory & Power Modules
Core Advantages
1.Superior Thermal Performance
Single-component non-curing thermal gel features high thixotropy and plasticity to fill wide, uneven gaps under light pressure. With thermal conductivity of 6.0–10.0 W/m-K, it efficiently dissipates heat for high-power devices.
2.Low-Stress Component Protection
Ultra-low compression stress fits precision parts and avoids damage to sensitive electronics during assembly.
3.Long-Term Stable Reliability
Low-outgassing formula resists sagging and cracking, maintaining stable shape under temperature cycling and vibration, ideal for communications equipment.
Fill-Pad US800 Key Features
☑ Thermal Conductivity: 8.0W/m-K
☑ Good surface wetting property
☑ Low compression force
☑ High compressibility
☑ Low oil bleeding
☑ Low outgassing
Typical Applications
Telecommunications, wireless infrastructure & network servers
Optical modules
Automotive electronics
Hard disk drives and solid hard disk memory devices
Industry, LED lighting and power modules
Core Advantages
1.Excellent Thermal Performance
Fill-Pad US800 delivers great thermal conductivity and stable low thermal resistance even under low pressure.
2.Ultra-Soft & Low-Stress
Ultra-soft, it easily compresses under light pressure to fill gaps and stays tightly bonded for lasting reliable cooling.
3.Long-Term High Reliability
Low-outgassing and low-oozing formula resists pressure and temperature fluctuations, maintaining stable performance under diverse working conditions.
Fill-Pad SF800 Key Features
Thermal Conductivity: 8.0W/m-K
Good surface wetting property
Silicone free, no silicone contamination
Low outgassing
Low oil bleeding
Typical Applications
Optical modules
Telecommunications, wireless infrastructure & network
Automotive electronics
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
Core Advantages
1.Excellent Thermal Performance
With a thermal conductivity of 8.0 W/m-K, its special formula delivers great surface wettability for tight contact and efficient heat transfer.
2.Silicone-Free Formulation
Ceramic-filled silicone-free material, no silicone outgassing, safe for silicone-sensitive electronics.
3.Outstanding Reliability
Low outgassing and minimal oil bleed. It remains stable under varying temperature and pressure for diverse harsh working environments.
