Thermal Solution for High-End Laptops

 

Background

With high-end AI ultrabooks and gaming laptops trending ultra-thin and high-performance, CPUs and GPUs generate intensive heat under heavy loads. Heat accumulation in compact chassis easily causes thermal throttling and system lag. As laptop functions and technologies continuously upgrade, stricter standards are applied to process efficiency and product reliability. Efficient thermal management is essential to stabilize device performance and extend service life.

 

Recommended Materials

1.Thermally Conductive Phase Change Material Fill-PCM 800

2.Liquid Metal Fill-LM 800

 

Fill-PCM 800 Key Features

☑ Low thermal resistance

☑ Silicone-free, no silicone contamination

☑ Natural surface tack

☑ Low viscosity

☑ High long-term reliability

☑ Good handling and reworkability

 

Typical Applications

CPU, GPU, and other chipset

IGBT Module

Memory Modules

Automotive

TV, game console and other consumer electronics

 

Core Advantages

1.Ultra-Low Thermal Resistance

The low viscosity of the molten state allows the formation of thin BLTs under slight pressure, thereby significantly reducing thermal resistance and improving heat transfer efficiency.

2.Outstanding Durability & Stability

Thermal performance remains intact after continuous high-temperature exposure, thermal shock and 85°C/85%RH humidity aging tests with no performance degradation.

3.User-Friendly Handling

Solid at room temperature before phase change with natural tack, enabling simple assembly and convenient rework.

 

Liquid Metal Fill-LM 800 Key Features

☑ High thermal conductivity

☑ Ultra-low thermal resistance

☑ Good wetting, handling and reworking

☑ Good thixotropy, not flowable to avoid short circuit

☑ High reliability, no pump out/dry out, no crack/slump

☑ No corrosion of copper

 

Typical Applications

CPU, GPU and other chip-set

Memory equipment

Consumer Electronics

Automotive Electronics

TV, game console, etc

 

Core Advantages

1.Optimized Paste Formulation

Fill-LM800 high-performance liquid metal thermal paste eliminates the fluidity defect of pure liquid metal, preventing leakage and circuit contamination for safer and more stable application.

2. Ultra-Low Thermal Resistance

It fills interfacial gaps completely to realize void-free contact, delivering ultra-low thermal resistance, boosting heat dissipation efficiency and extending component service life.

3. Compatible with Multiple Processing Methods

With excellent thixotropy, wettability and ductility, it can be applied via stencil printing, manual coating and other processes.