Thermal Solutions for Lasers

 

Background

As laser power keeps rising, pump sources generate extremely high heat flux. Heat easily builds up inside compact sealed housings due to limited cooling paths, causing hotspots that degrade laser output stability and service life. Thermal management has become a key challenge for laser R&D and manufacturing.

 

Recommended Materials

Thermally Conductive Phase Change Material Fill-PCM 550SP

 

Fill-PCM 550SP Key Features

☑ High thermal conductivity & ultra-low thermal resistance

☑ Silicone free

☑ Self-adhesive surface

☑ Long-term high reliability

☑ High thixotropy, no oozing under pressure

 

Typical Applications

Laptops & Desktops

Graphics Processors

Memory Devices

Consumer Electronics: TVs, Game Consoles, etc.

Automotive Electronics

 

Core Advantages

1.Superior Thermal Conductivity

Fill-PCM 550SP has low viscosity in the molten state. Slight pressure can achieve ultra-thin BLT and low thermal resistance to enhance overall heat dissipation efficiency.

2.Stable Long-term Thermal Performance

It maintains stable thermal resistance with no performance loss after high-temperature aging, thermal shock and 85℃/85%RH tests.

3.Validated Under Strict Cycling Conditions

No cracking or sagging after 1000 vertical thermal cycles (-40℃~85℃). No hotspots appear on IGBT modules through 1000 cycles (-40℃~125℃), ensuring reliable mechanical and cooling performance.