Thermally Conductive Pad: Fill-Pad 810
8.0W/mK Thermally Conductive Pad: Fill-Pad 810
- Thermal Conductivity: 8.0W/m-K
- Good surface wetting property
- Low oil bleeding, low outgassing
- Glass fiber free substrate to reduce the thermal resistance
- High insulation
- No powder or glue will fall off
- Datasheet
What is the Thermally Conductive Pad Fill-Pad 810？
Techinno Fill-Pad 810 is an ultra-thin gap filler material which combines 8.0W/m-K thermal conductivity with good surface wetting properties and high flexibility. It is designed for thin interfaces and not reinforced with glass fibers, but still has good mechanical properties and can be easily handled during assembly.
Fill-Pad 810 has properties of low volatility and low oil bleeding. The unique formula is designed to provide better integrity and won’t fall out of the powder or glue. And high dielectric strength due to the absence of metal powders in the formulation.
What are the main application scenarios for Fill-Pad 810?
The typical applications of Thermally Conductive Pad: Fill-Pad 810
Optical modules
Telecommunications, wireless infrastructure & network servers
Automotive electronics
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
