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Thermally Conductive Putty-Pad

Low stress, low oil bleeding

Techinno Fill-PT Series products are putty pads designed for applications requiring low compression force to conform over irregular interfaces and allow low thermal resistance. The network cross-linked polymer structure provides superior long term reliability over dispensable gel. The material’s putty-like design enables excellent gap-filling capability for applications with large dimensional variances or multiple gaps. Meanwhile, these products have good handling performance just like the traditional pads during high volume assembly. Fill-PT Series have good tack surface and require no additional adhesive to mate to heat source and heat sink.

Typical Applications

  • 5G Telecommunication Base Station
  • Network Server
  • Power Devices & Modules
  • Optical Module
  • GPU Module
  • LCD,PDP and Laser TV Displays
  • Hard Disk Storage Devices
  • Automotive Electronics OBC, Inverter

Specifications

FAQ

1.What are the main application scenarios for Thermally Conductive Putty-Pad?

Thermally Conductive Putty-Pad is a high-performance thermal interface material. Leveraging its ultra-softness, easy compressibility, low oil bleeding, and low residual stress, it is widely used in stress-sensitive electronic components such as those for AIDC. Key application scenarios include:

Thermally Conductive Putty-Pad for Graphics Card Module Applications

Excellent flexibility and high compressibility give it outstanding gap-filling capability, allowing it to bridge the gaps between the heat sink and components of varying heights, thereby compensating for structural tolerances. Low residual stress not only ensures reliability but also protects stress-sensitive components inside the graphics card from damage.

Thermally Conductive Putty-Pad for Server/Switch Motherboard Applications

Ultra-soft, it achieves high compression deformation under extremely low pressure, maintaining good wettability and effectively reducing interfacial thermal resistance. Its low oil-bleeding characteristic significantly minimizes the risk of contamination to precision areas such as the PCB. With excellent reliability, it ensures efficient heat dissipation for servers operating 7×24 hours continuously.

Thermally Conductive Putty-Pad for 5G Communication base stations, wireless communication equipment, and other applications

The low hardness characteristic allows it to conform under low pressure, generating minimal compressive and residual stress, thereby perfectly protecting fragile chips and solder joints. The low oil-bleeding property reduces the risk of device contamination. Additionally, the sheet material is easy to rework, facilitating device disassembly and maintenance.

Thermally Conductive Putty-Pad for Automotive Electronics Applications

Low stress makes it suitable for precision-sensitive components in automotive electronics modules (such as ECU, etc.), protecting them from damage. The inherent tackiness allows for pre-attachment, facilitating automated assembly line integration. The product meets automotive requirements for temperature resistance, vibration resistance, and long service life, ensuring thermal management reliability in extreme environments (-40°C to 125°C).

2.How should Thermally Conductive Putty-Pad be properly stored to ensure quality?

To ensure that Thermally Conductive Putty-Pads maintain stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:

Environmental conditions
① Temperature: 15 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.

Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.

3.How should Thermally Conductive Putty-Pad be packaged?

The packaging of Thermally Conductive Putty-Pad shall comply with the following requirements:

Keep sealed in the original packaging; avoid folding, heavy pressure, or contact with sharp objects to prevent mechanical damage or contamination.

4.What are the precautions to be taken before using Thermally Conductive Putty-Pad?

Pay attention to the integrity of the packaging. After opening the package, carefully inspect the condition of the pad. If the pad has become dry, brittle, or lost its flexibility, it indicates that its performance may have significantly degraded, and it is not recommended for use. It is advised to wear protective gloves throughout the entire operation to prevent oils from your hands from contaminating the pad surface.

5. How to order Thermally Conductive Putty-Pad?

Ordering methods are as follows:

Thickness Tolerance: >1mm, ±10%; 0.5-1mm, ±0.1mm
The thickness can be customized according to requirement.Please inquire the available thickness before ordering
Custom sized configurations and/or cut parts are available with dimensions less than 457*457mm
Versions A1 or NT1 can be supplied according to customer’s requirements

For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.

6. What key precautions and safety tips should be understood before use Thermally Conductive Putty-Pad?

① Do not eat

② Store away from children

③ Store away from combustion source

④ Please use in reference to MSDS

⑤ Keep the application interface clean

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