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Thermally Conductive Putty-Pad Model:Fill-PT 1200

12W/mK Thermally Conductive Putty-Pad Fill-PT 1200

  • High thermal conductivity of 12.0W/m-K
  • Ultra-soft, low compression stress and residual stress
  • High compressibility
  • Excellent gap-filling capability
  • Low oil-bleeding
  • Excellent surface wetting
  • Easy to handle

What is the Thermally Conductive Putty-Pad Fill-PT 1200?

Fill-PT 1200 is an ultra-soft product made of thermal conductive putty pad with 12.0W/m-K thermal conductivity. The special structure achieves extremely minimal compression stress and residual stress on components. The product also has excellent surface wettability and low thermal resistance. As a result, the mechanical and thermal stresses inside the power device will be reduced. The cross-linked polymer structure provides superior long-term reliability over dispensable gel. Its putty-like design enables excellent gap-filling capability for applications with large dimensional variances or multiple gaps, eliminates the oil-bleeding and pump-out compared with thermal grease. Meanwhile, this product have good handling performance just like the traditional pads during large-scale assembly.

What are the main application scenarios for Fill-PT 1200?

The typical applications of Thermally Conductive Putty-Pad Fill-PT 1200

5G Telecommunication base station
Network server
Power devices & modules
Optical module
LCD, PDP and Laser TV displays
Hard disk storage devices

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