Thermally Conductive Putty-Pad Model：Fill-PT 800

What is the Thermally Conductive Putty-Pad Fill-PT 800

Fill-PT800 is an ultra soft putty pad with 8.0W/m-K thermal conductivity. The special structure achieves extremely minimal compression stress and residual stress on components. The product also has excellent surface wettability and low thermal resistance. As a result, the mechanical and thermal stresses inside the power device will be reduced. The cross-linked polymer structure provides superior long-term reliability over dispensable gel. Its putty-like design enables excellent gap-filling capability for applications with large dimensional variances or multiple gaps, eliminates the oil-bleeding and pump-out compared with thermal grease. Meanwhile, this product have good handling performance just like the traditional pads during large-scale assembly.