Thermally Conductive Pads Low Volatility Series: Fill-Pad LV300
3.0W/mK Thermally Conductive Pad: Fill-Pad LV300
- Thermal Conductivity: 3.0W/m-K
- Good surface wetting property
- Naturally tacky or available with tack – free on one side
- High compressibility for low stress applications
- Low outgassing, low oil bleeding
- ∑D3 -D10<100ppm
- Datasheet
What is the Thermally Conductive Pad Fill-Pad LV300？
Techinno Fill-Pad LV300 is a high performance gap filler material which combines 3.0W/m-K thermal conductivity with excellent pressure versus deflection characteristics. The unique formula achieves minimal compression stress and residual stress on components while also yielding optimized surface wetting and low thermal resistance. The Fill-Pad LV300 has good surface wetting property, low volatility and very low small molecule content and it is especially suitable for optical devices.
Fill-Pad LV300 as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.
What are the main application scenarios for Fill-Pad LV300?
The typical applications of Thermally Conductive Pad: Fill-Pad LV300
Optical modules
Telecommunications, wireless infrastructure & network servers
Automotive electronics
Optical Transceiver Module
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
