Thermally Conductive Pads Low Volatility Series: Fill-Pad LV600
6.0W/mK Thermally Conductive Pad: Fill-Pad LV600
- Thermal Conductivity: 6.0W/m-K
- Good surface wetting property
- Naturally tacky or available with tack – free on one side
- High compressibility for low stress applications
- Low outgassing
- High flexibility
- Datasheet
What is the Thermally Conductive Pad Fill-Pad LV600？
Techinno Fill-Pad LV600 is a high performance gap filler material which combines 6.0W/m-K thermal conductivity with excellent pressure versus deflection characteristics. The unique formula achieves minimal compression stress and residual stress on components while also yielding optimized surface wetting and low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.The Fill-Pad LV600 has low volatility and excellent mechanical properties and it is especially suitable for optical devices.
Fill-Pad LV600 as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.
What are the main application scenarios for Fill-Pad LV600?
The typical applications of Thermally Conductive Pad: Fill-Pad LV600
Optical modules
Telecommunications, wireless infrastructure & network servers
Automotive electronics
Optical Transceiver Module
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
