Thermally Conductive Pad: Fill-Pad P300
3.0W/mK Thermally Conductive Pad: Fill-Pad P300
- Thermal Conductivity: 3.0W/m-K
- Good surface wetting property
- High insulation
- High compressibility under low pressure
- Naturally tacky or tack-free on one side available
- High flexibility
- Datasheet
What is the Thermally Conductive Pad Fill-Pad P300？
Techinno Fill-Pad P300 is one single sided thermal conductive silicone rubber compound with PI film as substrate. The unique formula enables low compression stress while also remaining minimal residual stress on components. Its good surface wetting capability minimizes the interface thermal impedance. Fill-Pad P300 has a series of advantages such as ultra soft, high compressibility under low pressure, high insulation, abrasion resistance, tear resistance, puncture resistance, etc., which can fully meet the needs of various applications.
What are the main application scenarios for Fill-Pad P300?
The typical applications of Thermally Conductive Pad: Fill-Pad P300
Telecommunications, wireless infrastructure & network servers
Optical modules
Automotive electronics
Industry, LED lighting and power modules
LCD, PDP and Laser TV displays
Hard disk drives and solid hard disk memory devices
