Thermally Conductive Pad: Fill-Pad P310

What is the Thermally Conductive Pad Fill-Pad P310？

Techinno Fill-Pad P310 is a high performance gap filler with 4.0W/m-K thermal conductivity. The unique formula design enables it to have good surface wetting and excellent mechanical properties, which can be suitable for a variety of application scenarios.

Fill-Pad P310 is a single sided thermally conductive silicone rubber compound with PI film as substrate (PI can be speci-fied). The product has many advantages such as thin thickness, high thermal conductivity, low thermal resistance, high insulation, wear resistance, tear resistance, puncture resistance and so on. It can fully meet the needs of related applications in the automotive field such as PTC. The surface of Fill-Pad P310 has weak viscosity, which is convenient for automated production.