Thermally Conductive Pad: Fill-Pad P311
4.0W/mK Thermally Conductive Pad: Fill-Pad P311
- Thermal Conductivity: 4.0W/m-K
- Good surface wetting property
- High insulation
- Good mechanical property
- Smooth and non-sticky on surface, convenient for automated production
- Datasheet
What is the Thermally Conductive Pad Fill-Pad P311？
vTechinno Fill-Pad P311 is one single sided thermal conductive silicone rubber compound with PI film as substrate. The products have a series of advantages such as thin thickness, high thermal conductivity, low thermal resistance, high insulation, wear resistance, tear resistance, puncture resistance, etc., which can fully meet the needs of related applications such as MOSFET, IGBT, SIC modules. The surface of Fill-Pad P311 is smooth and non-stick, which is convenient for automated production.
What are the main application scenarios for Fill-Pad P311?
The typical applications of Thermally Conductive Pad: Fill-Pad P311
Battery module and cooling plate heat dissipation
Battery pack
Automotive electronics equipment
Power supply and power conversion equipment
MOSFET, IGBT, SIC modules
