Thermally Conductive Pad: Fill-Pad UT600
6.0W/mK Thermally Conductive Pad: Fill-Pad UT600
- Thermal Conductivity: 6.0W/m-K
- Good surface wetting property
- Silicone free, no silicone contamination
- Low oil bleeding, low outgassing
- High reliability
- Low residual stress and good self-healing ability
- High dielectric strength
- Datasheet
What is the Thermally Conductive Pad Fill-Pad UT600？
Techinno Fill-Pad UT600 is an ultra-thin gap filler material which combines 6.0W/m-K thermal conductivity with good surface wetting properties and high flexibility. It is designed for thin interfaces and not reinforced with glass fibers, but still has good mechanical properties and can be easily handled during assembly.
The Fill-Pad UT600 has low volatility, low oil bleeding and excellent mechanical properties. The non-silicone formulation ensures that there is no silicone contamination and it is especially suitable for electronic applications that are sensitive to silicone volatiles.
What are the main application scenarios for Fill-Pad UT600?
The typical applications of Thermally Conductive Pad: Fill-Pad UT600
Optical modules
Telecommunications, wireless infrastructure & network servers
IGBT
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
