Thermally Conductive Pad: Fill-Pad UT300
3.0W/mK Thermally Conductive Pad: Fill-Pad UT300
- Thermal Conductivity: 3.0W/m-K
- Good surface wetting property
- Ultra-low thermal resistance at low pressure
- Non-glass fiber substrate for low self-resistance and good handling
- Datasheet
What is the Thermally Conductive Pad Fill-Pad UT300？
Techinno Fill-Pad UT300 is an ultra-thin gap filler material which combines 3.0W/m-K thermal conductivity with excellent thermal properties and high flexibility. It is designed for thin interfaces and not reinforced with glass fibers, but still has good mechanical properties and can be easily handled during assembly.
Fill-Pad UT300 is ideal for low-voltage applications and thermal solutions for handheld devices with thin interface gaps and to meet limited space requirements. With high insulation and reliability, the product guarantees thermal stability from -40°C to 125°C and is available in a range of thicknesses from 0.2mm to 0.5mm.
What are the main application scenarios for Fill-Pad UT300?
The typical applications of Thermally Conductive Pad: Fill-Pad UT300
Mobile devices: cell phones, laptops, game consoles
Ultra-thin Laptops
Consumer Electronics
LED lights
Automotive electronics
Wireless routers
