Techinno Fill-Pad Ultra Thin Series thermally conductive pad products are designed for thin interfaces and not reinforced with glass fibers, but still has good mechanical properties and can be easily handled during assembly.
The unique formula is designed to provide better integrity and won’t fall out of the powder or glue. And high dielectric strength due to the absence of metal powders in the formulation.
Ultra Thin Series
Typical Applications
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Telecommunications, Wireless Infrastructure, Optical Modules -
LCD, PDP, Laser TV displays -
Industry, LED lighting, Power Modules -
IGBT Modules -
Hard Disk Drives and Solid Hard Disk Memory Devices -
Consumer Electronics -
Automotive Electronics
Specifications
Related Product
FAQ
Main Application Scenarios
1.Optical modules
Ultra-thin thickness fits miniature compact optical transceivers with tiny assembly gaps. Low thermal resistance delivers efficient heat transfer without occupying internal space of precision optical components.
2. Telecommunications, wireless infrastructure & network servers
Ideal for densely arranged PCB boards and compact core chips inside communication equipment and servers. Thin design solves narrow gap heat dissipation of miniaturized communication hardware.
3.Automotive electronics
Ultra-thin design fits narrow gaps of vehicle compact electronic assemblies, with wide temperature resistance to adapt harsh vehicle working conditions. Ideal for OBC, vehicle control units, on-board displays and sensor modules, ensuring stable heat dissipation for miniaturized automotive power electronics.
4. Industry, LED lighting and power modules
Suits miniaturized industrial controllers, compact LED driving power supplies and small power modules, realizing thin-layer heat conduction for compact power equipment.
5. LCD, PDP and laser TV displays
Fits slim display internal narrow gaps between drive ICs and backlight heat sinks, meeting thinning design requirements of modern ultra-thin TVs and screens.
6. Hard disk drives and solid hard disk memory devices
Ultra-thin soft material fits narrow gaps of mini SSD and HDD control chips, quickly exporting heat without squeezing delicate storage chips.
To ensure that Thermally Conductive Pads (Ultra Thin Series) maintains stable thermal conductivity and workability within its shelf life, please follow the storage requirements below:
Environmental conditions (applicable to all forms)
① Temperature: 0 °C to 35 °C
② Relative humidity: ≤ 65 % RH
③ Avoid direct sunlight, high temperature, high humidity, or corrosive gas environments.
Shelf life
12 months from the date of packaging. After the shelf life has expired, it is recommended to first verify the thermal performance before further use; only continue use if the product passes verification.
The packaging of Thermally Conductive Pads (Ultra Thin Series) shall comply with the following requirements:
Avoid contamination and compression, control temperature and humidity while keeping away from light, seal to prevent scratches, and limit stacking height.
Before use, inspect the thermally conductive pad for any signs of damage, scratches, bubbles, deformation, contamination, hardening, oil bleed, or cracking. If any are found, please discard it immediately and replace it with a new one.
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- Thickness Tolerance: >1mm, ±10%; 0.5-1mm, ±0.1mm
- The thickness can be customized according to requirement.Please inquire the available thickness before ordering
- Customsized configurations and/or cut parts are available with dimensions less than 457*457mm
- Versions A1 or NT1 can be supplied according to customer’s requirements. (A1: Single-sided tackified; NT1: Single-sided de-tackified)
For more ordering information (such as minimum order quantity, lead time, sample requests, etc.), please contact our sales or technical support team.
① Do not eat
② Store away from children
③ Store away from combustion source
④ Please use in reference to MSDS
⑤ Keep the application interface clean
