Fast AI upgrades and soaring computing power push data centers into an era of ultra-high power density. Tightly packed CPUs, GPUs, optical modules and other chips leave minimal space, creating tough cooling hurdles:
1.Intense localized heat buildup from dense high-power chips, triggering throttling and system crashes
2.High interface thermal resistance, as tiny air gaps block heat transfer between parts
3.Hidden reliability threats; delicate components risk pressure damage, requiring thermal materials with low outgassing, silicone-free composition and stable high-temperature performance
Techinno Fill-Pad US1600 Silicone-Free Thermal Gap Pad
Techinno unveils Fill-Pad US1600, a custom silicone-free thermal pad built to fix these industry pain points. With 16W/m·K top-tier thermal conductivity, low-stress conformability and zero silicone content, it fully addresses cooling demands of compact AI hardware.
- 16W/m·K Ultra-High Thermal Conductivity
This gap pad delivers 16.0 W/m-K conductivity, optimized for AI data center high-heat loads.
Higher assembly pressure improves surface contact, cuts thermal resistance and upgrades cooling efficiency. Multiple thickness sizes are available to match different assembly gaps.
- Good surface wetting property & Low-stress
With ultra-soft texture and superior wettability, Techinno Fill-Pad US1600 closely fits uneven surfaces and fills microscopic gaps to compensate for assembly tolerances, lowering interfacial thermal resistance and enhancing device operational stability.
It provides the right amount of residual stress to maintain a good adhesion to the interface and ensures life cycle reliabilit.
- Silicone-Free Composition
No silicone formulation eliminates siloxane volatilization and contamination, perfect for sensitive precision electronic assemblies.
It maintains stable thermal performance after rigorous reliability tests: 150°C isothermal baking, -55°C~125°C thermal shock, and 85°C/85% RH HAST testing.
If you are facing board-level heat dissipation bottlenecks in data center deployment, welcome to contact our team for sample evaluation and professional technical support.
