AI large models keep expanding, pushing computing demand to surge sharply. This puts heavy pressure on optical interconnection in cloud data centers. 1.6T optical modules are widely commercialized, and 3.2T+ products will launch soon. High-speed optical modules are vital for AI clusters to realize high bandwidth, low power consumption and dense interconnection.
Key Thermal Pain Points for Optical Modules
Technology upgrades bring tougher thermal control issues. Higher optical module power and denser data center deployments create conflicting demands: high power output, limited space, stable reliability and easy plugging. Liquid cooling and advanced thermal materials are key fixes for these conflicts.
In liquid cooling setups, heat dissipation efficiency hinges on how well cold plates touch optical modules. Bare contact between module shells and cages creates large thermal resistance, weakening cooling. Ordinary thermal materials easily wear out or break after frequent plugging, breaking heat transfer routes. Old solutions cannot handle intense heat loads and frequent plug-in operations.
Techinno Delivers Plug-in Optical Module Cooling Solution
Techinno’s new T-Plug 820S serves external thermal management for optical modules. Its innovative design resolves core industry pain points and removes major barriers to mass rollout of high-speed optical modules.
Core Advantage 1: Low Interfacial Thermal Resistance
Interfacial thermal resistance decides cooling performance. T-Plug 820S lowers resistance between optical cages and module shells, speeding heat transfer to cold plates to keep high-power modules running stably.
Core Advantage 2: Superior Plug & Wear Resistance
Ordinary thermal materials easily get damaged from frequent plugging. T-Plug 820S is optimized for heavy plug use.
Lab tests prove it survives over 2,000 plug cycles. Only minor friction marks appear, with no cracking or delamination and steady performance retained.
Core Advantage 3: Long-Term Reliability
Data center environments demand robust thermal materials. T-Plug 820S passes strict multi-condition reliability tests:
- Thermal resistance stability: After high-temp, 85°C/85% humidity and thermal shock aging, thermal resistance changes by less than 10%.
- Low oil bleed: No silicone oil seepage at 25°C and 80°C, preventing interface contamination.
3.Low volatility: No fogging or condensation after 72 hours at 125°C volatile oil film testing.
Upgrade from Traditional PI+PCM Structures
Many existing pluggable thermal parts use PI film plus phase change material (PCM). T-Plug 820S upgrades this structure: stainless steel film replaces PI film, thermal silicone pad replaces PCM. This fully stops PCM leakage during plugging.
PCM melts and leaks easily, while the silicone composite stays solid with zero leakage risk. It matches traditional products in thermal resistance yet far outperforms them in reliability and abrasion resistance; stainless steel film lasts much longer than PI film under repeated friction.
Extra Support & Matching Products
We supply complete performance parameter charts. Besides TIM products, Techinno offers custom mounting fixture design to speed up customer installation and deployment.
For optical module internal cooling, we recommend our Fill-CIP 1120 one-component curing thermal gel — high-reliability, low oil bleed and low volatility. Together, T-Plug 820S and Fill-CIP 1120 form a full internal & external thermal management package for optical modules.
Closing
Rising AI computing power pushes optical modules toward higher bandwidth and power density, making thermal control a critical industry bottleneck. T-Plug 820S is tailor-made to fill gaps between module housings and liquid cooling interfaces, lifting heat conduction and plug durability. It enables large-scale rollout of high-speed optical modules in AI data centers.
Message us or check Techinno’s official website for datasheets and free samples.
