Communication & Data Center

Thermal Solution for Network Switches   Background Driven by rapid AI iteration and surging computing power, data centers are stepping into high power density era. Network switches feature highly integrated onboard components including optical modules, power ICs and computing chips. Concentrated heat flux and limited PCB space bring severe thermal […]

Thermal Conductivity Solutions for Optical Modules   Background Driven by surging demand for AI computing power, the optical module market is experiencing explosive growth. With rapid iterations of 800G and 1.6T products, power consumption of single modules has risen to 25–45W, creating an increasingly severe conflict between high power draw

Thermal Interface Solution for AI Servers Background GPU power consumption of AI servers keeps rising. Air cooling easily leads to thermal throttling and excessive energy consumption. Liquid cooling with cold plate is widely applied in general computing clusters, while immersion liquid cooling is applied for ultra-high computing power scenarios. Challenges including high heat