As AI models scale up, computing power demand surges, driving 1.6T optical modules toward mass deployment and 3.2T+ products on the horizon. High-speed optical modules are vital for AI clusters, yet rising power densities and compact form factors intensify thermal challenges—especially with liquid cooling interfaces and repeated plugging cycles. Conventional thermal materials suffer wear, scraping, and failure under frequent insertion/removal, failing to meet high–heat-flux and high-durability requirements.
Techinno T-Plug 820S is purpose built for external thermal interface filling between optical module housings and liquid cooling cold plates. It features a stainless steel film substrate bonded with a high performance silicone pad, directly applied to the plug in surface. This design significantly reduces interfacial thermal resistance, enhances heat transfer, and delivers exceptional plugging durability—balancing thermal efficiency and operational reliability.
Core Advantages
- Low Interfacial Thermal Resistance– Minimizes resistance between the cage and module shell, accelerating heat to the cold plate and ensuring stable operation of high power modules.
- Superior Plug & Abrasion Resistance– Optimized against repeated insertion damage. Verified by >2,000 plug cycles; surface marks appear but no cracking or delamination, and performance remains stable.
- Excellent Reliability–
- Thermal resistance stability: After high temperature, 85/85, and thermal shock aging tests, thermal resistance change rate ≤10%.
- Oil bleeding: No bleeding beyond product boundary at 80°C and 25°C; low-bleed design prevents interface contamination.
- Volatile film: No condensation or fogging after 125°C/72h testing, ensuring long term module stability.
Upgraded from Traditional PI+PCM Structure
The conventional PI film + PCM approach poses leakage risks during phase change. T-Plug 820S replaces PI with stainless steel film and PCM with thermal silicone pad, eliminating leakage entirely. Stainless steel offers better abrasion resistance and longer life, while thermal resistance remains comparable—achieving a substantial reliability upgrade.
T-Plug 820S is tailored for optical module to liquid cooling interface filling, improving heat conduction and plugging endurance, and supporting large scale high speed module deployment in AI data centers. For internal module thermal needs, we recommend Techinno one component post curing thermal gel Fill-CIP 1120—high reliability, low bleeding, low volatility—providing a complete internal+external thermal solution. For details or samples, please contact us or visit the Techinno official website.
