Thermally Conductive Gap: Fill-Pad SF310
3.0W/mK Thermally Conductive Gap: Fill-Pad SF310
- Thermal Conductivity: 3.0W/m-K
- Good surface wetting property
- Silicone free, no silicone contamination
- High compressibility under low pressure
- High resilience
- Low oil bleeding
- Low outgassing
- Datasheet
What is the Thermally Conductive Gap Fill-Pad SF310？
Techinno Fill-Pad SF310 is a high performance gap filler material which is made of polyurethane resin and thermal conductive fillers. The unique formula achieves good mechanical propertiesand high resilience while also yielding optimized surface wetting and low thermal resistance. The Fill-Pad SF310 has the properties of low volatility and low oil bleeding, and contains no small silicone molecules. It is particularly suitable for electronic applications that are sensitive to silicone volatiles.
What are the main application scenarios for Fill-Pad SF310?
The typical applications of Thermally Conductive Gap: Fill-Pad SF310
Camera modules
Telecommunications, wireless infrastructure & network servers
Automotive electronics
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
