Thermally Conductive Gap: Fill-Pad SF800
8.0W/mK Thermally Conductive Gap: Fill-Pad SF800
- Thermal Conductivity: 8.0W/m-K
- Good surface wetting property
- Silicone free, no silicone contamination
- Low outgassing
- Low oil bleeding
- Datasheet
What is the Thermally Conductive Gap Fill-Pad SF800？
Techinno Fill-Pad SF800 is a high performance gap filler material with a thermal conductivity of 8.0W/m-K, which is made of non-silicone resin and thermal conductive fillers. The unique formula achieves good mechanical properties and high resilience while also yielding optimized surface wetting and low thermal resistance.
The Fill-Pad SF800 has the properties of low volatility and low oil bleeding, and contains no small silicone molecules. It is particularly suitable for electronic applications that are sensitive to silicone volatiles.
What are the main application scenarios for Fill-Pad SF800?
The typical applications of Thermally Conductive Gap: Fill-Pad SF800
Optical modules
Telecommunications, wireless infrastructure & network servers
Automotive electronics
Industry, LED lighting and power modules
LCD, PDP and laser TV displays
Hard disk drives and solid hard disk memory devices
