Thermally Conductive Gap: Fill-Pad 150

What is the Thermally Conductive Gap Fill-Pad 150？

Techinno Fill-Pad 150 is an ultra soft gap filler material which combines 1.5W/m-K thermal conductivity with the properties of high compressibility under low pressure and excellent resilience. The unique formula achieves minimal compression stress and residual stress on components while also yielding optimized surface wetting and low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Fill-Pad 150 has excellent mechanical property, can be used in a variety of application environments. Fill-Pad 150 as a standard product is naturally tacky on both sides and requires no additional adhesive for mating.Non-tacky treatment on one side is also available for some special applications.