Thermally Conductive Gap: Fill-Pad 500C

What is the Thermally Conductive Gap Fill-Pad 500C？

Techinno Fill-Pad 500C is a cost-competitive and high performance gap filler material which combines 5.0W/m-K thermal conductivity with high resilience. The unique formula design enables it to maintain good mechanical strength, providing tension and bending resistance. With good surface wetting properties to minimize interface thermal resistance, coupled with excellent handling performance, this design can be effectively applied under various working conditions while ensuring structural integrity. The product has excellent mechanical properties and extremely low oil bleeding while having high thermal conductivity, which can effectively protect electronic devices from damage and pollution in applications. It’s especially suitable for the automobile industry.
Fill-Pad 500C can be used to cover uneven or irregular device surfaces, fully fill the gap between heat-generating components and heat sinks, boards or chassis, and effectively protect electronic devices from damage in application. Fill-Pad 500C as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.