Thermally Conductive Gap: Fill-Pad HV800

What is the Thermally Conductive Gap Fill-Pad HV800？

Techinno Fill-Pad HV800 is a high performance gap pad material with a thermal conductivity of 8.0 W/m-K. The unique formula design enables it to maintain good mechanical strength. It is designed for applications with high thermal performance requirements. Fill-Pad HV800 has low outgassing, low oil bleeding, and high insulation properties, good surface wetting and lower thermal resistance, which provides the right amount of residual stress to maintain a good adhesion to the interface and ensures life cycle reliability, and it is especially suitable for applications which is sensitive to siloxane volatiles.

The standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment on one side is also available for some special applications.