Thermally Conductive Gap: Fill-Pad 200C
Thermally Conductive Gap: Fill-Pad 200C
2.0W/mK Thermally Conductive Gap: Fill-Pad 200C
- Thermal Conductivity: 2.0W/m-K
- Good surface wetting property
- Naturally tacky or available with tack- free on one side
- High compressibility for low stress applications
- Fiberglass reinforced version is available to enhance tear resistance
- Datasheet
What is the Thermally Conductive Gap Fill-Pad 200C？
Techinno Fill-Pad 200C is a cost-competitive thermally conductive gap pad which is made of silicone resin and thermal conductive fillers. The unique formula achieves minimal compression stress and residual stress on components while also yielding optimized surface wetting and low thermal resistance.
The Fill-Pad 200C can be used to cover uneven or irregular device surfaces, fully fill the gap between heat-generating components and heat sinks, boards or chassis, and effectively protect electronic devices from damage in application. Fill-Pad 200C as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment in one side is also available for some special applications.
What are the main application scenarios for Fill-Pad 200C?
The typical applications of Thermally Conductive Gap: Fill-Pad 200C
Battery module and cooling plate heat dissipation
Battery pack
Automotive electronics equipment
Power Supplies
Charging pile inductor module
