Thermally Conductive Gap: Fill-Pad 300C
3.0W/mK Thermally Conductive Gap: Fill-Pad 300C
- Thermal Conductivity: 3.0W/m-K
- Good mechanical properties, high resilience, tension and bending resistance
- High breakdown voltage, excellent electrical insulation performance
- Low oil bleeding
- Naturally tacky or tack-free on one side available
- Good surface wetting
- High compressibility under low pressure
- Datasheet
What is the Thermally Conductive Gap Fill-Pad 300C？
Techinno Fill-Pad 300C is a cost-competitive thermally conductive gap pad which is made of silicone resin and thermal conductive fillers. The unique formula achieves minimal compression stress and residual stress on components while also yielding optimized surface wetting and low thermal resistance.
The Fill-Pad 300C can be used to cover uneven or irregular device surfaces, fully fill the gap between heat-generating components and heat sinks, boards or chassis, and effectively protect electronic devices from damage in application. Fill-Pad 300C as a standard product is naturally tacky on both sides and requires no additional adhesive for mating. Non-tacky treatment in one side is also available for some special applications.
What are the main application scenarios for Fill-Pad 300C?
The typical applications of Thermally Conductive Gap: Fill-Pad 300C
Automotive electronics and power batteries
Electronic control unit, domain controller
Capacitor, inductor, power module
Telecommunications, wireless infrastructure & network servers
LCD, PDP and Laser TV displays
Industrial, LED lighting
Hard disk drives and solid hard disk memory devices
