Fueled by AI, big data and 5G, automotive E/E architectures are evolving from distributed ECUs to centralized domain controllers and central computing platforms. ADAS domain SoCs process massive multi-sensor data and complex autonomous driving algorithms, leading to sharply elevated power density and heat generation, which creates tough thermal management bottlenecks.
Core Thermal Challenges for ADAS Domain Controllers
- Higher power density needs premium thermal materials
- Tough automotive environments demand high reliability
- Mass production requires good process compatibility
PCM & TPM: Ideal TIMs for ADAS Chips
Techinno PCM and TPM outperform traditional thermal materials comprehensively:
– vs two-part thermal adhesives: Less die wear, lower thermal resistance, vibration resistance, flexible assembly
– vs thermal grease: Equal thermal conductivity, superior anti-pump-out, anti-sagging & self-repair
– vs graphite sheets: No chipping/cracking, lower cost
Balancing thermal performance, reliability, cost and manufacturability, they meet ADAS domain controllers’ automotive-grade cooling and long-life demands.
Techinno Fill-PCM 800 High-Performance Phase Change Material
Developed for extreme heat dissipation scenarios, Fill-PCM 800 features low thermal resistance, high reliability and easy handling for ADAS domain controller thermal management.
Outstanding Thermal Performance
After phase transition, Fill-PCM 800 reaches ultra-low BLT under low compression, drastically cutting interfacial thermal resistance for superior cooling capacity.
Excellent Long-Term Reliability
It passes rigorous automotive reliability tests including high-temperature aging, thermal shock and 85℃/85% RH humidity aging with zero thermal performance degradation. No extrusion, cracking or sagging occurs during long-term operation to withstand vehicle vibration and impact.
In 1000 thermal cycles ranging from -40℃ to 125℃, Fill-PCM 800 shows negligible pump-out, outperforming standard thermal grease.
Flexible Process Compatibility
Supplied as rolls, sheets and custom shapes with natural tack for fast, precise assembly. The paste screen-printable variant Fill-PCM 800SP further expands compatibility with automated production lines.
Techinno Fill-TPM 800 Ultra-Thin Thermal Interface Material
Custom-built for severe ADAS working conditions, Fill-TPM 800 boasts high cohesion and self-repair properties. It effectively inhibits pump-out triggered by large chip warpage and uneven heat distribution, featuring low thermal resistance, great gap filling, premium anti-sagging and anti-pump-out performance.
Superior Anti-Sagging Performance
Maintains stable shape without sagging during long-term high-temperature durability tests, meeting strict stability standards for automotive electronics.
Reliable Anti-Pump-Out Capacity
High structural cohesion delivers consistent thermal resistance within 70–120μm under vibration cycling, a critical advantage for demanding ADAS applications.
Vibration & Impact Resistance
Mechanical certification confirms no displacement or cracking under long-term vibration and mechanical shock, retaining stable structure across wide temperature ranges.
With three core merits — extreme temperature resistance, consistent long-term performance and mechanical stress tolerance, Fill-TPM 800 withstands harsh automotive environments and delivers stable long-run cooling for ADAS domain controllers.
Conclusion
Ideal thermal interface materials for domain controllers must integrate efficient heat transfer, high reliability, easy assembly and mass production compatibility.
Equipped with comprehensive superior performance, Techinno thermal products build robust thermal barriers for domain controllers, acting as trusted thermal management partners for large-scale intelligent vehicle deployment.
